型號(hào) |
品牌 | 封裝 | 批號(hào) | 查看 | |
---|---|---|---|---|---|
LP3981ILDX-2.8 | TI | 6-WSON (3x4) | New | 詳細(xì) | |
SN74LVC16T245GQLR | TI | 56-BGA MICROSTAR JUNIOR (7.0x4.5) | New | 詳細(xì) | |
UC1845AMDREP | TI | 8-SOIC | New | 詳細(xì) | |
SN74GTLP2033DGGR | TI | 48-TSSOP | New | 詳細(xì) | |
TLC542CN | TI | 20-PDIP | New | 詳細(xì) | |
LM2734X EVAL | TI | New | 詳細(xì) | ||
LMH0307SQE/NOPB | TI | 16-WQFN (4x4) | New | 詳細(xì) | |
TLC27M2AIP | TI | 8-PDIP | New | 詳細(xì) | |
LMV822DG4 | TI | 8-SOIC | New | 詳細(xì) | |
TNETV2685FIBZUTA9 | TI | 529-FCBGA (19x19) | New | 詳細(xì) | |
SG2524D | TI | 16-SOIC | New | 詳細(xì) | |
TLC7135CN | TI | 28-PDIP | New | 詳細(xì) | |
LP3873ES-5.0/NOPB | TI | DDPAK/TO-263-5 | New | 詳細(xì) | |
TL4050C10QDCKT | TI | SC-70-5 | New | 詳細(xì) | |
TPIC71002TDCARQ1 | TI | 48-HTSSOP | New | 詳細(xì) | |
LP3966ES-1.8 | TI | DDPAK/TO-263-5 | New | 詳細(xì) | |
DAC124S085CISD/NOPB | TI | 10-WSON (3x3) | New | 詳細(xì) | |
TL7757CLPR | TI | TO-92-3 | New | 詳細(xì) | |
SN65LVDS348DR | TI | 16-SOIC | New | 詳細(xì) | |
LM3671MFX-1.2/NOPB | TI | SOT-23-5 | New | 詳細(xì) |