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羅斌森

  • VSC8584XKS-06

  • Manufacturer : Microchip Technology
    Packaging : Tray
    Part Status : Active
    Mounting Type : Surface Mount
    Package / Case : 256-BGA
    Supplier Device Package : 256-BGA (17x17)

極速報(bào)價(jià)

型號(hào)
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