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羅斌森

  • VSC8584XKS-05

  • Manufacturer : Microchip Technology
    Packaging : Tray
    Part Status : Active
    Mounting Type : Surface Mount
    Package / Case : 256-BGA
    Supplier Device Package : 256-BGA (17x17)

極速報(bào)價(jià)

型號(hào)
 品牌 封裝 批號(hào) 查看
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ADM00419 Microchip New 詳細(xì)
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UCS1001-3-BP Microchip 20-QFN (4x4) New 詳細(xì)
MCP1703T-3002E/MC Microchip 8-DFN (2x3) New 詳細(xì)